Ansys Icepak

Ansys Icepak, the intelligent Electronic component cooling simulation software, is your go-to solution for efficiently managing heat in electronic systems. This cutting-edge CFD (computational fluid dynamics) tool accurately predicts heat transfer, temperature, and airflow within various electronic components such as power electronics, IC packages, assemblies, enclosures, and PCBs. With Ansys Icepak, you unlock a realm of advanced electronic cooling solutions powered by the renowned Ansys Fluent CFD solver. This robust software empowers you to conduct comprehensive thermal studies on electronic assemblies, ICs, PCBs, and packages, encompassing radiation, convection, and conduction heat transfer analyses. Dive deeper into your designs with species analysis, and leverage the tool's capabilities for modeling laminar and turbulent flows, including convection and radiation phenomena. Furthermore, Ansys Icepak bridges the gap between electrical and thermal realms with its embedded Joule heating analysis feature, allowing you to seamlessly integrate electrical voltage, current excitations, thermal sources, and loads into your simulations. The software equips you with a versatile toolkit for setting up parametric runs and exploring design variations through the innovative LPV ROM functionality. Experience unparalleled efficiency with Ansys Icepak as it accelerates solver initialization, meshing, and MCAD geometry loading by 10 to 100 times, thanks to its performance enhancements. Stay ahead in the realm of electronic cooling simulation and design with Ansys Icepak - the smart choice for precise and efficient heat management in electronics.